Feb 01

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New SOLMAT Publication for XPV lab – Congrats Vincent!

A new publication from XPV Lab team has just been released in Solar Energy Materials and and Solar Cells (SOLMAT) journal entitled “Probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron X-ray microdiffraction”. Congrats to Vincent, Ihor and Sasi and the rest involved for the piece!

Solar Energy Materials and Solar Cells

Volume 162, April 2017, Pages 30–40

Probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron X-ray microdiffraction
V.A. Handaraa, b,I. Radchenkoa, S.K. Tippabhotlaa,Karthic. R.Narayanana,G. Illyac,M. Kunzd,N. Tamurad,A.S. Budimana, e, ,

  • a Singapore University of Technology and Design, 487372, Singapore
  • b Center for Solar Photovoltaics Materials & Technology (CPV), Surya University, Tangerang 15810, Indonesia
  • c Buddhi Dharma University, Tangerang 15115, Indonesia
  • d Advanced Light Source (ALS), Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA 94720, United States
  • e SunPower Corporation, R&D, San Jose, CA 95134, U.S.A.
Received 16 May 2016, Revised 4 October 2016, Accepted 15 December 2016, Available online 24 January 2017


Thin (<150 µm) silicon solar cell technology is attractive due to the significant cost reduction associated with it. Consequently, fracture mechanisms in the thin silicon solar cells during soldering and lamination need to be fully understood quantitatively in order to enable photovoltaics (PV) systems implementation in both manufacturing and field operations. Synchrotron X-ray Microdiffraction (µSXRD) has proven to be a very effective means to quantitatively probe the mechanical stress which is the driving force of the fracture mechanisms (initiation, propagation, and propensity) in the thin silicon solar cells, especially when they are already encapsulated. In this article, we present the first ever stress examination in encapsulated thin silicon solar cells and show how nominally the same silicon solar cells encapsulated by different polymer encapsulants could have very different residual stresses after the lamination process. It is then not difficult to see how the earlier observation, as reported by Sander et al. (2013) [1], of very different fracture rates within the same silicon solar cells encapsulated by different Ethylene Vinyl Acetate (EVA) materials could come about. The complete second degree tensor components of the residual stress of the silicon solar cells after lamination process are also reported in this paper signifying the full and unique capabilities of the Synchrotron X-Ray Microdiffraction technique not only for measuring residual stress but also for measuring other potential mechanical damage within thin silicon solar cells.

Link: http://dx.doi.org/10.1016/j.solmat.2016.12.028

Full Paper: PDF

Permanent link to this article: http://xml.sutd.edu.sg/announcement/new-publication-for-xpv-lab-congrats-vincent