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Publications

NOTE: (All downloadable materials on this webpage are available for personal use only, and in accordance with the copyright laws that apply)

 

2017

From cells to laminate: probing and modeling residual stress evolution in thin silicon photovoltaic modules using synchrotron X-ray micro-diffraction experiments and finite element simulations

Sasi Kumar Tippabhotla, Ihor Radchenko, W.J.R. Song, Gregoria Illya, Vincent Handara, Martin Kunz, Nobumichi Tamura, Andrew A.O. Tay and Arief S. Budiman, Prog. Photovolt: Res. Appl. (2017), DOI: http://onlinelibrary.wiley.com/doi/10.1002/pip.2891/full

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Designing novel multilayered nanocomposites for high-performance coating materials with online strain monitoring capability

Hashina Parveen Anwar Ali, Ihor Radchenko Jiahui Zhou, Liu Qing, Arief Budiman
Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications (2017), 
DOI: https://doi.org/10.1177/1464420717695354

Effect of interconnect plasticity on soldering induced residual stress in thin crystalline silicon solar cells

S.K. Tippabhotla, I. Radchenko, Song W. M. Ridhuan, Andrew A.O. Tay, A.S. Budiman , Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th 734-737.  doi: http://dx.doi.org/10.1109/EPTC.2016.7861579

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Understanding size effects in the advanced through-silicon via interconnect schemes for 3D ICs

I. Ali, I. Radchenko, S.K. Tippabhotla, Song W. M. Ridhuan, Andrew A.O. Tay,  N. Tamura, S.M. Han, A.S. Budiman , Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th 748-751.  doi: http://dx.doi.org/10.1109/EPTC.2016.7861582

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Probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron X-ray microdiffraction

V.A. Handara, I. Radchenko, S.K. Tippabhotla, Karthic R. Narayanan,  G. Illya,  M. Kunz, N. Tamura, A.S. Budiman , Solar Energy Materials & Solar Cells 162 (2017) 30-40.  doi: http://dx.doi.org/10.1016/j.solmat.2016.12.028

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2016


Probing Phase Transformations and Microstructural Evolutions at the Small Scales: Synchrotron X-ray Microdiffraction for Advanced Applications in 3D IC (Integrated Circuits) and Solar PV (Photovoltaic) Devices

I. Radchenko, S.K. Tippabhotla, N. Tamura, A.S. Budiman , Journal of Electronic Materials (2016), Volume 45, Issue 12, pp 6222–6232. doi:10.1007/s11664-016-5012-5

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On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology 

Tian Tian, R. Morusupalli, H. Shin, H.-Y. Son, K. -Y. Byun, Y. -C. Joo, R. Caramto, L. Smith, Y. -L. Shen, M. Kunz, N. Tamura, A.S. Budiman , Procedia Engineering, Vol 139,  8th International Conference on Materials for Advanced Technologies (ICMAT2015), Symposium C – Solar PV (Photovoltaics) Materials, Manufacturing and Reliability, p. 101-111, 2016. doi: http://dx.doi.org/10.1016/j.proeng.2015.09.242

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Critical Temperature Shift for Stress Induced Voiding in Advanced Cu Interconnects for 32nm and Beyond

R. Morusupalli, R. Rao, T. -K. Lee, Y. -L. Shen, M. Kunz, N. Tamura, A.S. Budiman , Procedia Engineering, Vol 139,  8th International Conference on Materials for Advanced Technologies (ICMAT2015), Symposium C – Solar PV (Photovoltaics) Materials, Manufacturing and Reliability, p. 32-40, 2016. doi: http://dx.doi.org/10.1016/j.proeng.2015.09.229

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Backsheets under Damp Heat/Salt Environments towards Novel and Innovative Solar Photovoltaics Systems Design for Tropical Regions and Sea Close Areas

G. Illya, V. Handara, Luo Yujing, R. Shivakumar, A.S. BudimanProcedia Engineering, Vol 139,  8th International Conference on Materials for Advanced Technologies (ICMAT2015), Symposium C – Solar PV (Photovoltaics) Materials, Manufacturing and Reliability, p. 7-14, 2016.

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Center for Solar Photovoltaics (CPV) at Surya University: Novel and Innovative Solar Photovoltaics System Designs for Tropical and Near-Oceans Regions (An overview and Research Directions)

V. Handara, G. Ilya, S. Tippabhotla, R. Shivakumar, A.S. Budiman,. Procedia Engineering, Vol 139, International Conference on Materials for Advanced Technologies (ICMAT2015), Symposium C – Solar PV (Photovoltaics) Materials, Manufacturing and Reliability, p. 22-31, 2016.

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Fracture Mechanics and Testing of Interface Adhesion Strength in Multilayered Structures – Application in Advanced Solar PV Materials and Technology

R. Shivakumar, S. K. Tippabhotla, V. Handara, G. Ilya, A. Tay, F. Novoa, R. Dauskardt, A.S. Budiman., Procedia Engineering, Vol 139,
International Conference on Materials for Advanced Technologies (ICMAT2015), Symposium C – Solar PV (Photovoltaics) Materials, Manufacturing and Reliability, p. 47-55, 2016.

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Low Stress Encapsulants? Influence of Encapsulation Materials on Stress and Fracture of Thin Silicon Solar Cells as Revealed by Synchrotron X-ray Submicron Diffraction

K. N. Rengarajan, I. Radchenko, G. Illya, V. Handara, M. Kunz, N. Tamura, A. S. Budiman, Procedia Engineering, Vol 139, International Conference on Materials for Advanced Technologies (ICMAT2015), Symposium C – Solar PV (Photovoltaics) Materials, Manufacturing and Reliability,p. 76-86, 2016.

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Synchrotron X-ray Micro-diffraction: Probing Stress State in Encapsulated Thin Silicon Solar Cells

S. K. Tippabhotla, I. Radchenko, K. N. Rengarajan, G. Illya, V. Handara, M. Kunz, N. Tamura, A. S. Budiman, Procedia Engineering, Vol 139, International Conference on Materials for Advanced Technologies (ICMAT2015), Symposium C – Solar PV (Photovoltaics) Materials, Manufacturing and Reliability, p. 123-133, 2016.

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2015

 

Impact of deposition conditions on the crystallization kinetics of amorphous GeTe films

Chee Ying Khoo, Hai Liu, Wardhana A. Sasangka, Riko I. Made, Nobu Tamura, Martin Kunz, Arief S. Budiman, Chee Lip Gan, Carl V. Thompson., Jour. of Materials Science, 20 Oct 2015, pp. 1-9. 

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Enabling Plasticity Evolution in nanoscale Cu/Nb single-crystal multilayers as revealed by synchrotron X-ray microdiffraction

A.S. Budiman;
Karthic R. Narayanan, N. Li, J. Wang, N. Tamura, M. Kunz, A. Misra, Materials Science and Engineering A, Vol 635, 21 May 2015, 6- 12

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2014


Enabling thin silicon technologies for next generation c-Si solar PV renewable energy systems using synchrotron X-ray microdiffraction as stress and crack mechanism probe

A.S. Budiman;
G. Illya; V. Handara; W.A. Caldwell; C. Bonelli; M. Kunz; N. Tamura; D. Verstraeten,   Solar Energy Materials & Solar Cells. 2014-07-16 130: 303-308

 
2012


Plasticity of indium nanostructures as revealed by synchrotron X-ray microdiffraction

A.S. Budiman; G. Lee; M.J. Burek; D. Jang; S-M Han; N. Tamura; M. Kunz; J R., Greer; T Y. Tsui, Materials Science & Engineering A. 2012-03-15 538:89-97

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Plasticity in the nanoscale Cu/Nb single-crystal multilayers as revealed by synchrotron Laue x-ray microdiffraction

A.S. Budiman; S-M Han; N. Li; Q-M Wei; P. Dickerson; N. Tamura; M. Kunz; A. Misra,

Journal of Materials Research , 2012, Vol. 27 Issue 3, p599-611, 13p. Publisher: Cambridge University Press.

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Measurement of Stresses in Cu and Si around Through-Silicon Via by Synchrotron X-Ray Microdiffraction for 3-Dimensional Integrated Circuits

A.S. Budiman, H-A.-S. Shin, B.-J. Kim, S.-H. Hwang, H.-Y. Son, M.-S. Suh, Q.-H. Chung, K.-Y. Byun, N. Tamura, M. Kunz, Y.-C. Joo

Microelectron. Rel. 52, p. 530-533, 2012.

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Microcompression study of Al-Nb nanoscale multilayers

Y. Kim; A.S. Budiman; J.K. Baldwin; N A. Mara; A. Misra, S M Han

Journal of Materials Research, 2012, Vol. 27, Issue 3, p. 592-598

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Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing

H-A-S Shin; B-J Kim; J-H Kim; S-H Hwang; A.S. Budiman; H-Y Son; K-Y Byun; N. Tamura; M. Kunz; D-I Kim; Y-C Joo

Journal of Electronic Materials. April 2012, Vol. 41 Issue 4, p712, 8 p.

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2011

Growth and Structural Characterization of Cu/Nb Single Crystal Multilayers for in situ Synchrotron Laue X-Ray Microdiffraction Studies

A.S. Budiman, N. Li, J. K. Baldwin, J. Xiong, H. Luo, Q. Wei, N. Tamura, M. Kunz, K. Chen, A. Misra.

Thin Solid Film  519, p. 4137-4143, 2011
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Fabrication, microstructure and mechanical properties of tin nanostructures

M.J. Burek; A.S. Budiman; Z Jahed; N. Tamura; M. Kunz; S. Jin; S M J Han; G. Lee; C. Zamecnik; T Y. Tsui

Materials Science & Engineering A. 2011 528(18):5822-5832
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Grain boundary effects on the mechanical properties of bismuth nanostructures

M.J. Burek; S. Jin; M C. Leung; Z Jahed; J Wu; A.S. Budiman; N. Tamura; M. Kunz; T Y.Tsui

Acta Materialia. 2011 59(11):4709-4718
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Fabrication, structure and mechanical properties of indium nanopillars

G. Lee; J-Y Kim; A.S. Budiman; N. Tamura; M. Kunz; K. Chen; M.J. Burek; J R. Greer; T Y., Tsui

Acta Materialia. 2010 58(4):1361-1368
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2009

Electromigration-induced Plasticity: Texture Correlation and Implications for Reliability Assessment
A. S. Budiman, P. R. Besser, C. S. Hau-Riege, A. Marathe, Y. -C. Joo, N. Tamura, J. R. Patel and W. D. Nix.
J. Electron. Mater.38, iss. 3, p.379-391, 2009. (J.E.M. Editor’s Choice Paper)
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2008

A Search for Evidence of Strain Gradient Hardening in Au Submicron Pillars under Uniaxial Compression Using Synchrotron X-Ray Microdiffraction

A. S. Budiman, S. M. Han, J. R. Greer, N. Tamura, J. R. Patel and W. D. Nix. Acta Mater.,56, p. 602-608, 2008.

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2006

Crystal Plasticity in Cu Damascene Interconnect Lines Undergoing Electromigration As Revealed by Synchrotron X-Ray Microdiffraction

A. S. Budiman, N. Tamura, B. C. Valek, K. Gadre, J. Maiz, R. Spolenak, W. D. Nix and J. R. Patel. App. Phy. Lett., 88, 233515, 2006.

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